Interposer Package-on-Package (PoP) technology was developed and has been in very high-volume production over the last several years for high-end mobile application processors (APs). This is due to ...
Tom's Hardware on MSN
Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer
The patent was filed 18 months ago, and there's no further indication of ongoing development ...
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