The ability to engineer the thermal conductivity of materials allows us to control the flow of heat and derive novel functionalities such as thermal rectification, thermal switching and thermal ...
In a previous article we reviewed rapid forming of thermoplastic composites (TPC). In the second part of this three-part series, we’ll explore the thermal processes and how these can be managed, ...
To address the intense heat loads that limit the reliability of next-generation computers and ...
The University of Manchester's National Graphene Institute has spearheaded an international team to engineer a novel approach for controlling thermal emission, detailed in a paper published in Science ...
In recent years, rapid technological advancements in the field of high-performance computing have driven the development of increasingly sophisticated and powerful computing devices. This growth is ...
As three-dimensional integrated circuit (3D-IC) technology becomes the architectural backbone of AI, high-performance computing (HPC), and advanced edge systems, thermal management has shifted from a ...
HONG KONG (9 January 2024) — In recognition of his research and academic achievements in chemical and thermal process engineering and technical chemistry, Professor Charles Chunbao Xu of City ...